Application areas
⦁ Heat-dissipating PCB
Superior heat dissipation performance and lightweight product due to excellent vertical thermal conductivity compared to MCCL (Metal Copper Clad Laminate)
⦁ Telecommunication Equipment and Inverter
Ultra-high performance noise and static electricity suppression products, along with high thermal performance products, capable of handling 5G modules and inverters.
⦁ Semiconductor Packaging
High-density semiconductor package with superior heat dissipation performance that fully replaces ceramic materials
⦁ LED
Heat dissipation product with excellent vertical thermal conductivity
⦁ EV Battery
A product with V0 grade fire-resistant performance, excellent heat dissipation, and superior flame-retardant properties
⦁ Automotive electrical components
We plan to pursue the development of various products, including thermoplastic products, not limited to thermosetting products, by adjusting material ratios, particle arrangement, and dispersion technology.
